ECM LLC, based in Delaware, Ohio, has launched the Sol-Ag productline of electrically conductive interconnect adhesives. According to the company, the Sol-Ag series was developed to exhibit rubber-likeflexibility that reduces stress in the interconnect bond line, impartsresistance to thermal cycling and increases overall peel strength ofassembly.
Sol-Ag Series products also excel in accelerated dampheat conditions when tested to IEC standards, the company adds, and they have demonstrated unchanged electrical performance after 1,000 hours at 85C/85RH on tin-silver and copper surfaces.
